Synopsys and Intel Foundry accelerate customer readiness from silicon to systems on Intel 14A

Synopsys and Intel Foundry accelerate customer readiness from silicon to systems on Intel 14A

Certified AI-powered EDA flows, integrated multiphysics analysis, and a broad IP portfolio accelerate AI and multi-die at angstrom scale Designs

Key highlights

• Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs: Provide early insight into energy integrity, thermal and electromagnetic effects, improve predictability and accelerate convergence
• From DTCO to system-aware co-optimization: Extends co-optimization across silicon, packet, IP and system domains to enable full system realization with optimal PPA
• Leader in multi-die and advanced packaging: The Synopsys 3DIC compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs
• Broad IP portfolio for faster time-to-tapeouts: Interface and Foundation IP for Intel 14A – including PCIe 7.0, 224G SerDes, USB 4 and eUSB reduce integration risk and accelerate design maturity

SUNNYVALE, CALIFORNIA., July 27, 2026 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) announced today at the 2026 DAC Chips to Systems Conferenceexpanded its collaboration with Intel Foundry to certify AI-powered EDA flows on Intel 14A process technology and evolved design enablement from Design Technology Co-Optimization (DTCO) to system-aware co-design, building on its certified and production-ready EDA flows and IP portfolio for Intel 18A and Intel 18A-P technologies. As AI and high-performance computing designs move beyond monolithic scaling, success requires combining process technology with AI-enabled EDA operations, multi-die design, integrated multi-physics analysis, and a broad IP portfolio to accelerate system-level realization.

“Designing at Angstrom scale is no longer just about squeezing more power, power and area out of a process node. It’s about turning process innovation into predictable system-level results,” said Michael Buehler-Garcia, senior vice president at Synopsys. “Together with Intel Foundry, Synopsys is helping customers accelerate convergence, reduce late-stage rework, and achieve first-pass silicon success. We applaud the Intel Foundry team for its advancements on Intel 14A to expand advanced semiconductor manufacturing capabilities.”

“In this increasingly AI-driven world, Intel Foundry is committed to supporting our customers by accelerating innovation and delivering predictable execution from silicon to packaging of our most advanced technologies,” said Shawn Han, SVP and GM, Foundry Services, Intel Corporation. “Our extensive collaboration with Synopsys, including AI-driven, certified operations and IP, gives our customers greater ease of use and confidence in achieving their design goals.”

System-aware co-design: EDA meets multiphysics

With angstrom-scale geometries with back-side power delivery and dense 3D integration, electrical, thermal and mechanical effects can no longer be effectively analyzed in isolation. Synopsys is uniquely positioned to address this challenge with the integration of Synopsys-certified, AI-powered implementation and signoff flows and multiphysics analysis – including power integrity, thermal and electromagnetic solutions on Intel 14A.

Enabling the multi-die era

As multi-die design becomes mainstream in AI and HPC, Synopsys and Intel Foundry are expanding their proven collaboration to enable efficient system-level integration, analysis and optimization of advanced chiplet-based architectures. Synopsys’ 3DIC compiler-based reference design flow supports Intel’s advanced Embedded Multi-die Interconnect Bridge (EMIB) and Embedded Multi-die Interconnect Bridge-T (EMIB-T) packaging technology with early bump and TSV scheduling, automated UCIe and HBM routing, and unified multiphysics analysis across all chips. Designers can simultaneously analyze and optimize power networks, thermal gradients, and signal integrity across die, Intel EMIB and EMIB-T interconnect, and package, identifying system-level issues at design time rather than after tapeout.

Improve ecosystem readiness with a broad IP portfolio of Intel 18A, Intel 18A-P and Intel 14A

Synopsys and Intel Foundry continue to enable AI and HPC innovation with Synopsys’ growing portfolio of high-performance interfaces and base IP, available today for Intel 18A and Intel 18A-P, while expanding support for Intel 14A technologies, helping to reduce integration risk and shorten time to tapeout for complex SoCs and multi-die designs. New titles optimized for Intel 14A include:

• Interface IP, including 224G SerDes, PCIe 7.0, USB 4 and eUSB, meets the high throughput and connectivity requirements of next-generation AI and HPC applications
• Foundation IP, including embedded storage, logic libraries and IOs, helps optimize performance, power and area while reducing total cost of ownership.

resources

Join Synopsys for the 2026 DAC Chips to Systems Conference

Visitors can visit the Synopsys booth #631 to see the latest solutions and collaborations. For a complete list of Synopsys sessions and activities at DAC 2026, visit the Synopsys DAC 2026 events page.

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is a leader in silicon-to-system engineering solutions, enabling customers to rapidly develop AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions and design services. We work closely with our customers across industries to maximize their research and development capabilities and productivity, driving innovation today that fuels tomorrow’s ingenuity. Find out more at www.synopsys.com.

Forward-Looking Statements

This press release contains forward-looking statements that are subject to risks, uncertainties and other factors that could cause our actual results, timelines or achievements to differ materially. Information regarding potential risks, uncertainties and other factors that could affect our results of operations is contained in the filings we make from time to time with the SEC, including the sections entitled “Risk Factors” in our most recent Annual Report on Form 10-K and Quarterly Report on Form 10-Q.

Contacts

Kelli Wheeler: kelliw@synopsys.com
Pete Smith: pete.smith@synopsys.com
corp-pr@synopsys.com

SOURCE Synopsys, Inc.

https://news.synopsys.com/2026-07-27-Synopsys-and-Intel-Foundry-Fast-Track-Customer-Readiness-from-Silicon-to-Systems-on-Intel-14A